書目識別號
586464
書目型態
西文機讀編目格式-圖書(USMARC Bibliographic Format-Book)
書目參考 URL
http://dx.doi.org/10.1007/978-1-4939-2163-8
欄號/指標/分欄資料
035 $a978-1-4939-2163-8 003 DE-He213 005 20150917143753.0 006 m d 007 cr nn 008maaau 020 $a9781493921638 (electronic bk.) 020 $a9781493921621 (paper) 0247 $a10.1007/978-1-4939-2163-8$2doi 040 $aGP$cGP 0410 $aeng 050 4$aTK7885 072 7$aTJFC$2bicssc 072 7$aTEC008010$2bisacsh 08204$a621.39$223 090 $aTK7885$b.M835 2015 24500$aMore than Moore technologies for next generation computer design$h[electronic resource] /$cedited by Rasit O. Topaloglu. 260 $aNew York, NY :$bSpringer New York :$bImprint: Springer,$c2015. 300 $aix, 218 p. :$bill. (some col.), digital ;$c24 cm. 5050 $aImpact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration. 520 $aThis book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as "More than Moore" (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to "Moore's Law". Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 650 0$aComputer engineering. 650 0$aComputer organization. 65014$aEngineering. 65024$aCircuits and Systems. 65024$aElectronics and Microelectronics, Instrumentation. 65024$aProcessor Architectures. 7001 $aTopaloglu, Rasit O. 7102 $aSpringerLink (Online service) 7730 $tSpringer eBooks 85640$uhttp://dx.doi.org/10.1007/978-1-4939-2163-8$zTCU e-book 950 $aEngineering (Springer-11647) 095 $pES$dTK7885
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